| PART |
Description |
Maker |
| EPC-740-0.5 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-525-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-660-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-440-3.6 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-440-1.4 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-470-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| EPC-1300-1.0-3 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
| KIP-M25-1 |
Optical Monitoring Photodiode Chip
|
KODENSHI KOREA CORP.
|
| KIP-M1M-1 KIP-M2M-1 KIP-M3M-1 |
Optical Monitoring Photodiode Chip for KIP-MxM
|
KODENSHI KOREA CORP.
|
| S8865-64 S8865-128 S8865 |
Photodiode array combined with signal processing circuit chip
|
Hamamatsu Corporation
|
| S8865-256G |
Photodiode array combined with signal processing circuit chip 光电二极管阵列结合信号处理集成电路芯
|
Hamamatsu Photonics K.K.
|
| MXP22-C |
Multi Element Opto Arrays
Monolithic Photodiode Array-Chip
|
MICROSEMI[Microsemi Corporation]
|
